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Large Current External FET Controller Type Switching Regulators
Single-output Step-up,High-efficiency Switching Regulator (Controller Type)
BD9763FVM
No.09028EAT07
Description BD9763FVM is a 1-channel high efficiency step-up switching regulator. It is possible to choose small application space due to its high-speed operation (Max switching frequency 1.2MHz)
Features 1) Build-in under voltage lock out circuit. 2) High accuracy reference voltage (2.5V1.0%) 3) Establish maximum duty cycle internally. 4) CTL/SS terminal for both stand-by and soft-start function. (Soft-start time can be set by external capacitor) 5) MSOP8 thin and small package.
Applications Single-lens reflex cameras, digital video cameras, liquid crystal modules, DVD drive.
Absolute Maximum Ratings(Ta=25) Parameter Supply voltage Storage temperature range Power dissipation Junction temperature
*
Symbol Vcc Tstg Pd Tjmax
Limit 10 -55 to +150 587 * +150
Unit V mW
IC mounted on a PCB board (70mm x 70mm x 1.6mm, glass epoxy). Reduced by 4.7mW for each increase in Ta of 1 over 25.
Recommended Operating Conditions Parameter Supply voltage Oscillating frequency Operating temperature range Symbol Vcc fosc Topr Limit Min 4 100 -40 Typ 7 Max 9 1200 +85 Unit V kHz
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1/11
2009.05 - Rev.A
BD9763FVM
Electrical characteristics (Unless otherwise specified, Ta=25, Vcc=7.0V) Limits Parameter Symbol Min Typ Max Oscillator Oscillating frequency Frequency tolerance Swing voltage Stand-by, Soft start CTL/SS pin source current CTL/SS pin clamp voltage CTL threshold voltage PWM comparator 0% threshold voltage Maximum duty cycle Error amplifier Threshold voltage Band width Voltage gain Input bias current Maximum output voltage Minimum output current Output source current Output sink current Reference voltage Output voltage Load regulation Output short current Whole device Stand-by current Circuit current Output ON resistance Output rise/fall time Output source current Output sink current Under voltage lock out Threshold voltage Hysteresis width VUT VUThy 3.7 0.05 3.8 0.10 3.9 0.15 V V RON Tr/Tf IOUTSO IOUTSI 0.9 2.5 20 -0.80 0.85 8.0 nsec A A Cout=1000pF ICCS ICCA 420 3.4 610 5.0 960 7.8 A mA No load VREF VREFlo IVREF 2.475 -45 2.500 -16 2.525 10 -1 V mV mA IVREF=0mA IVREF=0 to -1mA VIN BW Av IIB VCH VCL IOI IOO 0.98 -150 2.3 -3.1 12 1.00 3.0 70 -70 2.4 0.03 -1.6 50 1.02 2.6 0.20 -1.0 125 V MHz dB nA V V mA mA VFB=1.0V VFB=1.0V AV=0dB D0 DMAX 1.5 80 1.6 90 1.7 99.5 V % ISS VSS VCTLTH -1.90 2.2 1.2 -1.00 2.4 1.3 -0.55 2.6 1.4 A V V VCTL/SS=1.5V fosc FDV Vpptr 522 -5 600 0 0.5 678 5 kHz % V RRT=24k Vcc=4 to 9V
Technical Note
Unit
Condition
Ta=-40 to 85,VCC=4 to 9V, OUT=0Vrush current Ta=-40 to 85,VCC=4 to 9V, OUT=VCCrush current Vcc sweep down
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2/11
2009.05 - Rev.A
BD9763FVM
Reference data (Unless otherwise specified, Ta=25)
Technical Note
Oscillatingfrequencyvs.Timingresistance
VREFvoltagevs.Ambienttemperature
2.53 VREF voltage [V] 2.52 2.51 2.5 2.49 2.48 2.47 -60 -40 -20 0 20 40 60 80 100 120 140
10000
Oscillatingfrequency [kHz]
1000
100 1 10 100 1000
Ambienttemperature []
Timingresistance(RT) [k]
Fig.1 VREF voltage - Ambient temperature
Oscillatingfrequencyvs.Ambienttemperature
Fig.2 Oscillating frequency - Timing resistance (RRT)
Oscillatingfrequencyvs.Ambienttemperature
650 Oscillatingfrequency [kHz] 630 620 610 600 590 580 570 560 550 -60 -40 -20 0 20 40 60 80 100 120 140
1200
RT=24k
Oscillatingfrequency [kHz]
640
1180 1160 1140 1120 1100 1080 1060 1040 1020 1000 -60 -40 -20 0 20 40 60 80 100 120 140
RT=10k
Ambienttemperature []
Ambienttemperature []
Fig.3 Oscillating frequency - Ambient temperature (RT=24k)
Fig.4 Oscillating frequency - Ambient temperature (RT=10k)
Block diagram
VCC 1 VREF 4 RT 8 VCC TRI
U.V.L.O
Vref
INV 5 Error
1.0V
Clamper
VREF
2 OUT PWM Vdt COMP
Amp
FB
6 T.S.D
7 CTL/SS
3 GND
Fig.5
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3/11
2009.05 - Rev.A
BD9763FVM
Pin configuration
Technical Note
1pin 2pin 3pin 4pin
VCC
RT CTL/SS FB INV
8pin 7pin 6pin 5pin
OUT GND VREF
Fig.6 Pin number , Pin name Pin No. 1 2 3 4 5 6 7 8 Pin name VCC OUT GND VREF INV FB CTL/SS RT Power supply FET driver output Ground Reference voltage (2.5V1%) output Inverting input of error amplifier Output of error amplifier Stand-by switch/Soft start capacitor connecting pin Timing resistor connecting pin Function
Block description VOLTAGE REFERENCE(VREF) BLOCK This voltage reference block generates 2.5V internal reference voltage. OSCILLATOR BLOCK Oscillator block sets the oscillating frequency adjusted by an external resistance in RT pin. The oscillating frequency can be set within a range of 100~1200kHz.. (See the description of how to set the frequency on page6.) PWM COMP The PWM comparator transforms the voltage outputted from error amp to PWM waveform and outputs to FET driver. The maximum duty cycle is limited up to 90%. ERROR AMP BLOCK The error amp block detects the output voltage from the INV pin, amplifies the difference between the detected voltage and the reference voltage, and outputs it to FB pin. The reference voltage is 1V2%. PROTECTION CIRCUIT BLOCK The under voltage lock out circuit is activated to shut down the whole circuit when the VCC voltage is up to 3.8V. When the thermal shutdown circuit detects abnormal heating of the chip (150), the output becomes off. And the output turns back on when the chip temperature goes down to a specific level.
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4/11
2009.05 - Rev.A
BD9763FVM
Application example
Technical Note
VOUT
R1
R2
VCC
VCC C1 OUT GND VREF
RT CTL/SS FB INV
RRT
C2 1F
ON/OFF H:OFF L:ON
Fig.7
Selecting application components (1) Output inductor It is recommended to use an inductor which satisfies the following rating current (the following value of current), and also has low DCR. The shield type inductor is preferable. I peak = Io(Vo/VIN) / + VIN(VOUT-VIN) / (2VOUTLf) [A] [ Io : Output Vo : Output voltage VIN : Input voltage : Efficiency L : Inductance f : Oscillating frequency ] (2) Output capacitor It is recommended to use the output capacitor which has the enough margin to maximum rating for output voltage and low fluctuation for temperature. The ripple voltage of the output is influenced by ESR of the output capacitor. Vripple = VIN(VOUT-VIN) / (VOUTLf)ESR [V] (f >> 1 / (2LC)Vo / VIN) [ Io : Output Vo : Output voltage VIN : Input voltage : Efficiency L : Inductance C : Output capacitor f : Oscillating frequency ] (3) FET It is recommended to use FETs which satisfy followings and have small Ciss or Qg and ON resistance. D-S Voltage : Over (Output voltage + Vf of Di) G-S Voltage : Over input voltage D-S Current : Over Ipeak at the section of output inductor (4) Diode It is recommended to use a schottky diode which satisfies followings and has low forward voltage drop and high switching speed. Maximum current : Over maximum output current Direct reverse voltage : Over output voltage
* Please provide sufficient margin in the choice of external components by factoring into the worst case characteristics and temperature range.
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5/11
2009.05 - Rev.A
BD9763FVM
(5) Setting the oscillator frequency Refer to Fig.5 and determine Timing resistor (RRT) when setting the oscillating frequency.
Oscillatingfrequencyvs.Timingresistance 10000
Technical Note
Oscillatingfrequency [kHz]
1000
100 1 10 100 1000 Timingresistance(RT) [k]
Fig.8 Oscillating frequency - Timing resistance (RRT)
(6) Setting the output voltage The output voltage is calculated by the following equation. Vo = VINVth(R1+R2)/R2 [V] R1,R2 : Resistor divider network VINth : Error amp threshold voltage (typ.1V) (but VoFB terminal voltage CTL/SS terminal voltage Dead-time setting voltage Stand-by threshold voltage Oscillator output
t(start)
Output waveform
t(soft)
VDUTY
ON/OFF
Fig.9
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6/11
2009.05 - Rev.A
BD9763FVM
Recommended board patterns
R1 R2
Technical Note
VOUT
Lay out by the shortest pattern. FET
Di
L VCC
C1 C2
1F
VCC OUT GND VREF
RT CTL/SS FB INV
RRT
Short GNDs at one point as this figure.
H:OFF L:ON
*Place these parts with attention about patterns shown in following Fig.7
Fig.10
RT VCC VCC RT RRT
OUT
C1
C1
OUT
CTL/SS
GND GND C2
FB
VREF
INV
VREF
C1 : Capacitor terminals have to be close enough to terminals of VCC and GND. It is safe to pass OUT signal line under C1. C2 : Capacitor terminals have to be close enough to terminals of VREF and GND. R1 : Pattern area has to be small enough to reduce parasitic capacitance of RT terminal. Fig.11 Recommended board patterns
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7/11
2009.05 - Rev.A
BD9763FVM
I/O Equivalent Circuit OUT (2) VREF (4)
Technical Note
VCC VCC 1.67k 50k
OUT 250k 200k GND 193k
VREF

GND INV (5) FB (6) VCC
VCC FB 20p INV
200k GND CTL/SS (7) RT (8) GND
VCC
20k
5k
100k
VREF
CTL/SS
500k
1k
1k
RT
GND
GND
Fig.12
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8/11
2009.05 - Rev.A
BD9763FVM
Technical Note
Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC deterioration or damage. Assumptions should not be made regarding the state of the IC(short mode or open mode) when such damage is suffered. A physical safety measure such as fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) GND potential Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin. Carry a voltage lower then or equal to the GND pin, including during actual transient phenomena. (3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (4) Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the presence of a foreign object may result in damage to the IC. (5) Operation in a strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (6) Thermal shutdown circuit (TSD circuit) This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit designed only to shut the IC off to prevent runaway thermal operation. do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of the thermal shutdown circuit is assumed. (7) Testing on application boards When testing the IC on an application board, connecting a capacitor to pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture the inspection process. (8) Common impedance Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). (9) Applications with modes that reverse VCC and pin potentials may cause damage to internal IC circuits. For example, such damage might occur when VCC is shorted with the GND pin while an external capacitor is charged. It is recommended to insert a diode for preventing back current flow in series with VCC or bypass diodes between VCC and each pin.
Bypass diode
Back current prevention diode
VCC
Output pin
Fig.13 (10) Timing resistor Timing resistor connected between RT and GND, has to be placed near RT terminal (8pin). And pattern has to be short Enough.
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9/11
2009.05 - Rev.A
BD9763FVM
Technical Note
(11) IC pin input This monolithic IC contains P + isolation and PCB layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when a resistor and transistor are connected to pins as shown in Fig.14, the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN). Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines With the N layer of other adjacent elements to operate as a parasitic NPN transistor. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in away that will trigger the operation of parasitic elements, such as by the application of voltage lower than the GND (PCB) voltage to input and output pins.
(Pin A) (Pin A) (Pin B)
GND
Parasitic diode GND (Pin B) Other adjacent element GND Parasitic elements
PCB GND Parasitic diode

PCB GND
Parasitic transistors
Fig.14
Power Dissipation Reduction
pd(W) 0.8 POWER DISSIPATION pd(W
0.6
0.4
0.587W
0.2
0
0
25
50
75
100
125
150
175
AMBIENT TEMPERATURE Ta( IC mounted on a ROHM standard board (70mm x 70mm x 1.6mm, glass epoxy)
Fig.15
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10/11
2009.05 - Rev.A
BD9763FVM
Ordering part number
Technical Note
B
D
9
Part No.
7
6
3
F
V
M
-
T
R
Part No.
Package FVM: MSOP8
Packaging and forming specification TR: Embossed tape and reel (MSOP8)
MSOP8

2.90.1 (MAX 3.25 include BURR)
8765
Tape
0.290.15 0.60.2
+6 4 -4
Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
Quantity Direction of feed
4.00.2
2.80.1
( reel on the left hand and you pull out the tape on the right hand
1pin
)
1 234
1PIN MARK 0.475 S +0.05 0.22 -0.04 0.08 S 0.65
+0.05 0.145 -0.03
0.9MAX 0.750.05
0.080.05
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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11/11
2009.05 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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